ʻO TF-MF201 APP ka pale ahi i hoʻololi ʻia i ka Melamine formaldehyde no ka uhi ahi.
Hoʻolauna
No ka loaʻa ʻana o ka thermostability maikaʻi no nā koi ʻokoʻa, hana ʻia kahi APP i mālama ʻia me ka Melamine formaldehyde resin modify.Ma ke kumu o ke ʻano II ammonium polyphosphate, hoʻohui ʻia ka melamine no ka mālama ʻana i ka uhi wela wela.Ke hoʻohālikelike ʻia me ke ʻano II ammonium polyphosphate, hiki iā ia ke hōʻemi i ka solubility i ka wai, hoʻonui i ka pale wai, hoʻonui i ka wai o ka pauka, hoʻomaikaʻi i ka pale wela a me ke kūpaʻa arc.He kūpono no ka pale ahi o ka epoxy resin a me ka resin unsaturated, i hoʻohana ʻia i nā kaula like ʻole, ka ʻōpala, nā pūpū o nā mea uila a me ka lole pale ahi.
Hōʻike
| Hōʻike | TF-MF201 |
| Ka nana aku | Pauda keʻokeʻo |
| P maʻiʻo (w/w) | ≥30.5% |
| N maʻiʻo (w/w) | ≥13.5% |
| pH waiwai (10% aq , ma 25 ℃) | 5.0-7.0 |
| Viscosity (10% aq , ma 25 ℃) | ＜10 mPa·s |
| Māmā (w/w) | ≤0.8% |
| Ka nui o ka ʻāpana (D50) | 15~25µm |
| Ka nui o ka ʻāpana (D100) | ＜100µm |
| Solubility (10% aq , ma 25 ℃) | ≤0.05g/100ml |
| Solubility (10% aq , ma 60 ℃) | ≤0.20g/100ml |
| Solubility (10% aq, ma 80 ℃) | ≤0.80g/100ml |
| Ka Mahana Decomposition (TGA, 99%) | ≥260 ℃ |
Palapala noi
| ʻOihana | Laki hikiwawe |
| Laau, palaka | DIN4102-B1 |
| PU ʻōhū paʻa | UL94 V-0 |
| Epoxy | UL94 V-0 |
| Ka uhi ʻana i ka intumescent | DIN4102 |
1. He kūpono kūpono no nā uhi pale ahi intumescent
2. Hoʻohana ʻia no ka pale ahi o ka uhi lole, hiki iā ia ke hana maʻalahi i ka lole pale ahi e hoʻokō i ka hopena hoʻopau iā ia iho mai ke ahi.
3. Hoʻohana ʻia no ka pale ahi o ka plywood, fiberboard, etc., liʻiliʻi hoʻohui nui, maikaʻi loa ka hopena o ka lapalapa ahi
4. Hoʻohana ʻia no ka resin thermosetting pale ahi, e like me ka epoxy a me ka polyester unsaturated, hiki ke hoʻohana ʻia ma ke ʻano he mea koʻikoʻi i ka lapalapa ahi.
Nā huahana pili
Nā huahana pili
