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Hoʻolālā Formula no MCA a me Aluminum Hypophosphite (AHP) i loko o ka uhi hoʻokaʻawale no ka hōʻemi ʻana o ke ahi.

Hoʻolālā Formula no MCA a me Aluminum Hypophosphite (AHP) i loko o ka uhi hoʻokaʻawale no ka hōʻemi ʻana o ke ahi.

Ma muli o nā koi kiko'ī o ka mea hoʻohana no nā uhi hoʻokaʻawale ahi-retardant, nā ʻano oMelamine Cyanurate (MCA)aAluminum Hypophosphite (AHP)ua kālailai ʻia penei:

1. Hoʻohālikelike me nā Pūnaehana Slurry

  • MCA:
  • Pūnaehana wai:Pono ka hoʻololi ʻana o ka ʻili (e laʻa, nā mea hoʻohui silane a i ʻole surfactants) no ka hoʻomaikaʻi ʻana i ka dispersibility; a i ʻole, hiki i ka agglomeration.
  • Nā ʻōnaehana NMP:Hiki ke hōʻike i ka pehu liʻiliʻi i loko o nā mea hoʻoheheʻe polar (manaʻo ʻia: e hoʻāʻo i ka nui o ka pehu ʻana ma hope o ka hoʻoinu ʻana i 7 lā).
  • AHP:
  • Pūnaehana wai:Maikaʻi ka hoʻopuehu ʻana, akā pono e mālama ʻia ka pH (hiki i nā kūlana acid ke kumu hydrolysis).
  • Nā ʻōnaehana NMP:Paʻa kemika kiʻekiʻe me ka pilikia o ka pehu liʻiliʻi.
    Ka hopena:Hōʻike ka AHP i ka hoʻohālikelike ʻoi aku ka maikaʻi, ʻoiai ʻo MCA e koi i ka hoʻololi.

2. Hiki ke hoʻololi i ke kaʻina hana kaʻina a me ka nui o ka ʻāpana

  • MCA:
  • D50 kumu: ~1–2 μm; pono i ka wili (e laʻa, ka wili ʻana i ke one) e hōʻemi i ka nui o nā ʻāpana, akā hiki ke hōʻino i kona ʻano papa, e pili ana i ka pono pale ahi.
  • Pono e hōʻoia ʻia ka like ʻole o ka wili ʻana (SEM observation).
  • AHP:
  • D50 kumu: maʻamau ≤5 μm; hiki ke wili i D50 0.5 μm/D90 1 μm (hiki i ka wili nui ʻana ke hoʻoulu i ka slurry viscosity spikes).
    Ka hopena:ʻOi aku ka ʻoi aku o ka hiki ke hoʻololi ʻana i ka nui o ka pōpō me ka haʻahaʻa o ke kaʻina hana.

3. Adhesion a me ka Abrasion Kū'ē

  • MCA:
  • ʻO ka polarity haʻahaʻa e alakaʻi i ka hoʻopili maikaʻi ʻole me nā kiʻi hoʻokaʻawale PE / PP; pono 5-10% acrylic-based binders (e laʻa, PVDF-HFP).
  • Pono e hoʻohui ʻia ka 0.5-1% nano-SiO₂ no ka hoʻomaikaʻi ʻana i ka pale ʻaʻahu.
  • AHP:
  • Hoʻokumu nā pūʻulu hydroxyl i luna i nā paʻa hydrogen me ka mea hoʻokaʻawale, e hoʻomaikaʻi i ka hoʻopili ʻana, akā pono mau ka 3-5% polyurethane binders.
  • ʻO ka paʻakikī kiʻekiʻe (Mohs ~3) hiki ke hoʻoheheʻe ʻia ka microparticle ma lalo o ka friction lōʻihi (koi i ka hoʻāʻo cyclic).
    Ka hopena:Hāʻawi ʻo AHP i ka hana holoʻokoʻa ʻoi aku ka maikaʻi akā pono ka hoʻopaʻa ʻana i ka binder.

4. Paʻa wela a me nā waiwai decomposition

  • MCA:
  • Ka wela decomposition: 260–310°C; ʻAʻole hiki ke hana i ke kinoea ma 120–150°C, hiki ʻole ke hoʻopau i ka holo ʻana i ka wela.
  • AHP:
  • Ka wela decomposition: 280–310°C, ʻaʻole lawa no ka hana kinoea haʻahaʻa wela.
    Pilikia nui:Hoʻopili ʻia nā mea ʻelua ma luna o ka pae i manaʻo ʻia (120–150°C).Nā pane:
  • Hoʻolauna i nā synergists haʻahaʻa haʻahaʻa (e laʻa, microencapsulated red phosphorus, decomposition range: 150–200°C) a i ʻole ammonium polyphosphate (APP, uhi ʻia e hoʻoponopono i ka decomposition i 140-180°C).
  • Hoʻolālā aMCA/APP hui (6:4 ratio)e hoʻohana i ka hana kinoea haʻahaʻa haʻahaʻa o APP + ka pale ʻana i ka lapalapa ahi a MCA.

5. Electrochemical a me ka Corrosion Kū'ē

  • MCA:
  • Hiki i ka electrochemically inert, akā ke koena free melamine (maʻemaʻe ≥99.5% koi ʻia) hiki ke hoʻopau i ka decomposition electrolyte.
  • AHP:
  • Pono e hōʻemi ʻia nā haumia ʻakika (e laʻa, H₃PO₂) (hoʻāʻo ICP: nā ion metala ≤10 ppm) i mea e pale ai i ka wikiwiki o ka LiPF₆ hydrolysis.
    Ka hopena:Pono nā mea ʻelua i ka maʻemaʻe kiʻekiʻe (≥99%), akā ʻoi aku ka maʻalahi o ka hoʻomaʻemaʻe ʻana iā MCA.

Manaʻo hoʻonā piha

  1. ʻO ke koho ʻana i ke ahi ahi mua:
  • Makemake ʻia:AHP (ka hoʻopuehu ʻana/adhesion kaulike) + ka mea hoʻoheheʻe haʻahaʻa haʻahaʻa (e laʻa, 5% microencapsulated ʻulaʻula phosphorus).
  • ʻOkoʻa:MCA hoʻololi ʻia (carboxyl-grafted no ka hoʻopuehu wai) + APP synergist.
  1. Hoʻoponopono kaʻina hana:
  • ʻO ke ʻano slurry:AHP (90%) + polyurethane binder (7%) + wetting agent (BYK-346, 0.5%) + defoamer (2%).
  • Nā ʻāpana wili:ʻO ka wili lepo me nā pahu 0.3 mm ZrO₂, 2000 rpm, 2 mau hola (kumu D90 ≤1 μm).
  1. Nā hoʻāʻo hōʻoia:
  • Hoʻoheheʻe wela:TGA (pohō kaumaha <1% ma 120°C/2h; puka kinoea ma 150°C/30min ma o GC-MS).
  • Paʻa electrochemical:Nānā SEM ma hope o 30 mau lā i ka hoʻoinu ʻia ma 1M LiPF₆ EC/DMC ma 60°C.

Manaʻo Hope

ʻAʻole ʻo MCA a me AHP wale nō e hoʻokō i nā koi āpau. Aʻōnaehana hybridʻōlelo ʻia:

  • AHP (matrix)+microencapsulated ʻulaʻula phosphorus (mea hana kinoea haʻahaʻa wela)+nano-SiO(kuʻi abrasion).
  • E hoʻopaʻa me ka resin aqueous adhesion kiʻekiʻe (e laʻa, emulsion composite acrylic-epoxy) a hoʻololi i ka hoʻololi ʻana o ka ʻili no ka nui o ka ʻāpana/palapala paʻa.
    Hoao hou akupono e hōʻoia i ka synergy thermal-electrochemical.

Ka manawa hoʻouna: Apr-22-2025